2024-03-28T21:44:40Z
https://oai.zbmath.org/v1/
oai:zbmath.org:7114623
2019-10-08T10:07:31Z
74
Wu, G. T.; Wu, J.; Zhang, L.
2019
7114623
English
Springer (Birkhäuser), Basel
https://zbmath.org/07114623
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Z. Angew. Math. Phys. 70, No. 4, Paper No. 126, 13 p. (2019).
74B05; 74M15
An analytical analysis of receding contact between a compressible elastic thin film and a rigid substrate due to spherical indentation
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